Glossary

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L

Laminating

(process) The process of bonding two or more layers of material together, using heat, pressure, and an adhesive.

LAN

Local Area Network. A data communications network spanning a limited area. It provides communications between three or more computers and peripherals, in most cases using high-speed media as it’s backbone.

Land

(circuit) The printed conductive portion of a printed circuit board.  See also pad and terminal area.

Laser

(device) Initial letters of Light Amplification by Stimulated Emission of Radiation. A device which takes incoherent light of various frequencies of vibration, and transforms them into a very narrow and intense beam of coherent light.

Lay

The length measured along the axis of a wire or cable required for a single strand (in stranded wire) or conductor (in cable) to make one complete turn about the axis of the conductor or cable.

Lead(s)

(component) Generally one or two wires cut to certain length with or without terminals.

Lead Frame

(process/packaging) A metal frame that includes the leads of a plastic encapsulated DIP. The frame holds the leads in place prior to encapsulation and is cut away after encapsulation.

Levels of packaging

(circuit) A framework of six categories or levels used to define electrical interconnections by function.

Level 1

A level of electrical interconnection that includes all those connections that link an active element to the terminals (leads) of the device. For example, the bond wire linking a semiconductor chip to its lead frame.

Level 2

All those connections linking a circuit board with the components mounted thereon. For example, the connection between the legs of a DIP switch and the circuit board.

Level 3

All those connections linking two or more circuit boards together. For example, the connection between motherboard and daughterboard.

Level 4

All those connections linking two or more functional subassemblies with the system enclosure. For example, the connection between a power supply and circuit board.

Level 5

All those connections that provide the input/output function of the system. For example, the connection between a circuit board and the connector that provides access to the internal workings of the machine.

Level 6

All those connections linking two or more systems. For example, the interconnection between terminals in a local area network.

Linear Circuit

(circuit) A circuit whose output is either an amplified version of its input, or a predetermined variation of its input.

Linear Polymer

(material) A polymer whose molecules form long chains without cross-linked or branch structures. Usually thermoplastic.

Line Cord

(component)

Standard – A two-wire cord terminating in a two-prong plug at one end.

Grounded – A two-wire-with-ground cord terminating in a three-prong plug.

Both types of line cord are used to connect electrical/electronic equipment or appliances to a power outlet.

Line Impedance

Impedance as measured across the terminals of a transmission line; frequently the characteristic impedance of the line.

Link

(fiber optic) A complete network to send and receive data via fiber optics, including a transmitter, receiver, fiber, and connectors.

Load

(component/electrical) The device or element in the electrical circuit that absorbs power and converts it into the desired form, such as light, heat, or motion.

Longitudinal Shield

A tape shield, flat or corrugated, applied longitudinally with the axis of the core being shielded.

Loom

(electrical) Flexible tubing or sheath, usually nonmetallic, for protecting electrical wires. A cotton-braided sheath is commonly used.

Loose Piece

(contact) A contact (or terminal) that is produced, packaged, and terminated individually for hand application tooling.

Lossy

(property) The property of being a poor conductor that absorbs and dissipates energy.

Low-Density Polyethylenes

(material) A group of polyethylenes whose density ranges between 0.915 – 0.925 g/cm³. They have more branching than high-density polyethylene, giving it a more flexible structure.

Lumped-Element Filter

(component) A filter whose filtering elements, such as ferrite beads, consist of discrete capacitance and inductance, rather than being uniformly distributed throughout. See also distributed-element filter.

LVDS

Low Voltage Differential Signals which reduce on-chip power consumption.