Like concentricity, a measure of the center of a conductor’s location with respect to the circular cross section of the insulation.
ECO
(component) Abbreviation for electron-coupled oscillator.
Edge Connector
(printed circuit) A connector into which the edge of a printed circuit board is inserted.
Edge-Mount Connector
(printed circuit) A connector that is mounted onto the edge of a printed circuit board.
Egg Crating
(connector) Insulation walls between each cavity within the contact/wire entry face of the housing – usually appearing as rectangular cells. Normally allows the rear portion of the contact to be fully protected by housing material, thereby preventing shorts between adjacent contacts, and minimizing the danger of shock. Sometimes used to improve cross-talk characteristics, or to minimize the flexing of wires and/or contacts.
EIA 568A
Electronic Industries Association. A commercial building wiring standard for voice and data communications developed in 1989 by the EIA.
Elastomer
(material) A material which at room temperature stretches under low stress to at least twice its length and snaps back to original length upon release of stress.
Electroless Plating
(process) A chemical process by which nonconductive materials may be plated with a thin highly conductive film without using electric current. A thicker deposit of the desired metal may then be applied using standard electroplating methods.
Electromagnetic Compatibility (EMC)
The ability of an electronic device to operate in its intended environment without its performance being affected by EMI and without generating EMI that will affect other equipment.
Electromagnetic Interference (EMI)
Unwanted electrical or electromagnetic energy that causes undesirable responses, degrading performance or complete malfunctions in electronic equipment. See also: noise.
Electromagnetic Propagation
Pertaining to the combined electric and magnetic fields associated with movements of electrons through conductors.
Electromotive Force (EMF)
See Voltage.
Electron
(general) A subatomic particle with a charge of 1.6 x 10-19 coulombs (or -1 elementary charge). Electrons are the reason physical phenomena such as electricity and magnetism exist.
Electronic Interference
(circuit) An electrical or electromagnetic disturbance that causes an undesirable response in electronic equipment. Electrical interference refers specifically to interference caused by the operation of electrical apparatus that is not designed to radiate electromagnetic energy.
Electrostatic Discharge
(electrical) The sudden discharge of electrostatic charge that occurs when a charged conductor is grounded.
Electro-Tinned
(process/material) Electrolytic process of tinning wire using pure tin.
Elongation
The fractional increase in the length of a material stressed in tension.
Embossing
(process) A marker identification by means of thermal indentation leaving raised lettering on the sheath material of cable.
EMC
(abbreviation/electrical) Electromagnetic compatibility. The ability of an electronic device to operate in its intended environment without its performance being affected by EMI and without generating EMI that will affect other equipment.
EMF
(abbreviation) Electromotive force (voltage). See voltage.
EMI
(abbreviation/electrical) Electromagnetic interference. Unwanted electrical or electromagnetic energy that causes undesirable responses, degraded performance, or complete malfunctions in electronic equipment. See noise.
EMI Filter
(component) A low-pass, usually miniature, filter intended for controlling or eliminating EMI.
Encapsulation
(process/packaging) The process of embedding electrical components and conductors in a mechanically protective coating.
Engaging Force
(connector) See contact engaging and separating force.
Environment
(device/system) The aggregate of all conditions (such as temperature, humidity, radiation, magnetic and electric fields, shock, and vibration) which externally influences the performance of an item.
Environmentally Sealed
(feature) A unit that is provided with gaskets, seals, grommets, potting, or other means to keep out moisture, dirt, air, or dust which might reduce or impair its performance. Does not include nonphysical environments such as RF and radiation.
Epitaxial Layer
(process/component) A thin precisely doped mono crystalline layer of silicone grown onto a heavily doped thick wafer, and into which the semiconductor junctions are diffused. In conventional integrated circuit processing, the thick wafer is “p” doped, and the epitaxial layer is “n” doped.
Epoxy
(material) A family of thermosetting resins used in the packaging of semiconductor devices. Epoxies form a chemical bond to many metal surfaces and may be cast or molded. Epoxy should not be confused with silicone resins.
Equalization
A process of compensating for increases in attenuation (signal loss) with frequency. Different frequencies are attenuated differently over a given distance.
Equilibrium Mode Distribution
(fiber optic) The condition in an optical fiber in which all allowable modes propagate their characteristic amount of optical energy.
ESD
(abbreviation) See electrostatic discharge.
Etchant
(process/component) A solution used to remove, by chemical reaction, the unwanted portion of conductive material bonded to a base.
Etched wire
(process) A process applied to fluoroplastic wire in which the wire is passed through a sodium bath to create a rough surface to allow epoxy resin to bond the fluoroplastic.
Etched wiring substrate
(IC) A printed conductive pattern formed by chemical, or chemical and electrolytic, removal of the unwanted portion of conductive material bonded to a base.
Etching
(process/component) The process of removing unwanted metallic substance bonded to a base – by chemical, or chemical and electrolytic, means.
ETFE
(abbreviation/polymer) A copolymer of ethylene and tetrafluoroethylene. This high temperature resin is well suited for wire insulation. It can withstand an unusual amount of physical abuse during and after installation, has very good electrical characteristics, good thermal and low temperature properties, and chemical inertness.
Ethylene Propylene Rubber
(material) These materials offer excellent resistance to ozone and weathering, good low temperature properties, good to excellent heat resistance and high temperature properties, and excellent electrical properties. Two types of the polymer are available – the copolymer based on ethylene and propylene only, and the terpolymer in which a small amount of un-saturation pendant to the chain is added.
Excite
(electrical) To initiate or develop a magnetic field in a motor or other electrical machine.
Extender
(material) A substance added to a plastic composition to reduce the amount of the primary resin required per unit volume.
Extraction tool
(connector) A tool used for removing a contact from a connector. Most AMP extraction tools will remove a contact in such a manner that the contact can be re-used, if desired.
Extrusion
(process) The flow of any substance as it fills voids under pressure.
Eyelet
(component) A short length of metal tubing used in the terminal holes of printed circuit boards to provide a through connection and a tight mechanical contact with the printed wiring prior to soldering. Eyelets are sometimes used in place of plated thru holes and should not be confused with “fillets” which serve only to hold the component in place prior to soldering, and promote solder wicking.
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