Characteristics and Comparisons of Other Conductors
Life Stability
Crimp Terminability
Solder
Service Temperature
Bare Copper (CU)
EXCELLENT – Slight loss of conductivity with heat aging
EXCELLENT – Contact resistance may vary with type of terminal
GOOD – When clean
210°F (99°C)
Tin Plated Copper (TC)
Conductivity and solderability deteriorates with heat aging at rated temperature due to migration of tin and copper and tin oxidation
GOOD – But contact resistance increases with time and can be variable
GOOD – Originally deteriorates with shelf life
300°F (149°C)
Silver Plated Copper (SC)
EXCELLENT – Not loss of conductivity with heat aging at rated temperature. Solderability shelf life remains good
EXCELLENT – Contact resistance remains low
EXCELLENT
390°F (199°C)
Nickel Plated Copper (NC)
Conductivity remains stable with heat aging at rated temperature
GOOD – But contact resistance may vary with time. Use plated steel terminal in some cases.
Requires active flux
480°F (249°C)
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