Conductor Material Comparison

Characteristics and Comparisons of Other Conductors

Life StabilityCrimp TerminabilitySolderService Temperature
Bare Copper (CU) EXCELLENT – Slight loss of conductivity with heat aging EXCELLENT – Contact resistance may vary with type of terminal GOOD – When clean 210°F (99°C)
Tin Plated Copper (TC) Conductivity and solderability deteriorates with heat aging at rated temperature due to migration of tin and copper and tin oxidation GOOD – But contact resistance increases with time and can be variable GOOD – Originally deteriorates with shelf life 300°F (149°C)
Silver Plated Copper (SC) EXCELLENT – Not loss of conductivity with heat aging at rated temperature. Solderability shelf life remains good EXCELLENT – Contact resistance remains low EXCELLENT 390°F (199°C)
Nickel Plated Copper (NC) Conductivity remains stable with heat aging at rated temperature GOOD – But contact resistance may vary with time. Use plated steel terminal in some cases. Requires active flux 480°F (249°C)

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